SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry’s first NVMe* PCIe ...

Package-on-package (PoP) assembly is a quickly evolving 3D packaging trend (or, to be more politically correct, "technique") that meets today's demand for lighter, faster and miniaturized electronics, ...

Intel’s BGA processors are definitely going to become a bigger part of Intel’s portfolio in the future and by the looks of things these BGA packages are mainly designed to transform the bottom segment ...

So, you’re trying to get a handle on BGA flip chip tech? It’s one of those things that sounds complicated, but once you break it down, it’s not so bad. Basically, it’s a way to connect chips to ...

Samsung Electronics has begun mass producing NVM Express (NVMe) PCIe SSD solutions in a single ball grid array (BGA) package for next-generation PCs and ultra-slim notebooks, according to the South ...

During electrical design process, certain design choices need to be made. One example is USB C type connector-based design with a straddle-mount connector. In such scenario, the overall PCB thickness ...

With shrinking chip sizes, Wafer Level Packaging (WLP) is becoming an attractive packaging technology with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the ...