New Centris(TM) Sym3(TM) Etch system`s innovative chamber architecture enables precision removal of materials to the atomic level Already installed as a production tool of record with multiple ...
SANTA CLARA, Calif.–Applied Materials Inc. today announced a new silicon etch chamber for 200- and 300-mm wafer DRAM fabs needing deep-trench etching technology for 100-nm and below process geometries ...
SAN JOSE, Calif. — Applied Materials Inc. has rolled out new and separate chemical vapor deposition (CVD) and etch systems for use in manufacturing advanced flash and DRAM memory chips. Applied ...
Achieves Damage-Free Atomic-Level Etching with a Wide Range of Optional Functions TOKYO--(BUSINESS WIRE)--Hitachi High-Technologies Corporation (TSE: 8036) (Hitachi High-Tech) announced the ...
New research paper entitled “Plasma-based area selective deposition for extreme ultraviolet resist defectivity reduction and process window improvement” from TEL Technology Center, Americas and IBM ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--Dec. 6, 2005--Applied Materials, Inc. today announced the Applied Centura(R) AdvantEdge(TM) Metal Etch, the most advanced system ...
Mass spectrometry, by contrast, is a powerful technique for the analysis of any process gas. Careful consideration of differences in pressure, reaction time scales and process flow is essential for ...
Chipmakers are ramping up a new range of device architectures, such as 3D NAND and finFETs. But to enable current and future devices, IC vendors will require new breakthroughs, including tools that ...
New Centris Sym3 Etch system's innovative chamber architecture enables precision removal of materials to the atomic level Already installed as a production tool of record with multiple customers, the ...
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